Dual in-line package
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DIL14_IC_HCF4093.jpg
In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and a row of electrical connecting pins along each of two opposite sides, usually the longer sides of the rectangle. A DIP is usually referred to as a DIPn, where n is the total number of pins).
DIPs may be used for integrated circuits (ICs, "chips"), like microprocessors, or for discrete components such as resistors or toggle switches. A typical DIP may be a microcircuit package with two rows of seven vertical leads (i.e., a DIP14) that is specially designed for mounting on a printed circuit board (PCB).
JEDEC-standard DIPs have the inter-lead spacing (lead pitch) specified as 0.1" (2.54 mm) and the row spacing is specified at 0.3" (7.62 mm).
Several DIP variants exist, mostly distinguished by packaging material:
- Ceramic Dual In-line Package (CERDIP)
- Plastic Dual In-line Package (PDIP)
- Shrink Plastic Dual In-line Package (SPDIP) – A shrink version of the PDIP with a 0.07" (1.778 mm) lead pitch
DIPs were the mainstream of the microelectronics industry in the 1970s and 80s. Their use has subsided in recent years due to the emerging new surface-mount technology (SMT) packages such as pin grid arrays (PGAs) and ball grid arrays (BGAs).
Sources
- Federal Standard 1037C
- Intel (1996). Packaging (databook). ISBN 1-55512-254-X.
